Which of the following is NOT true?

(A) CH2O Has a relatively high boiling point due to hydrogen bonding.
(b) BaCl2 is an example of an ionic sold.
(c) Ionic solids are poor conductors of heat and electicity.
(d) The melting point of Fe is higher than glucose.
(e) The melting point of diamond is higher than Cu.

All look true to me.

To determine which of the statements is NOT true, let's analyze each option:

(A) CH2O, also known as formaldehyde, does not have a relatively high boiling point due to hydrogen bonding. Instead, it experiences intermolecular forces like dipole-dipole interactions and London dispersion forces. Formaldehyde has a boiling point of -19 °C, which is relatively low. Therefore, option (A) is NOT true.

(b) BaCl2 is an example of an ionic solid. Ionic compounds, like BaCl2, are formed by the transfer of electrons from a metal to a nonmetal and typically have high melting and boiling points due to the strong electrostatic forces between ions. Therefore, option (b) is true.

(c) Ionic solids are poor conductors of heat and electricity. This statement is true since electrons in ionic solids are not free to move and conduct electrical current. Therefore, option (c) is true.

(d) The melting point of Fe (iron) is higher than glucose. This statement is also true since iron has a much higher melting point (1538 °C) compared to glucose (146 °C). Therefore, option (d) is true.

(e) The melting point of diamond is higher than Cu (copper). This statement is true as diamond has an extremely high melting point of around 3550 °C, while copper has a lower melting point of 1084 °C. Therefore, option (e) is true.

Based on our analysis, the statement that is NOT true is option (A) - CH2O has a relatively high boiling point due to hydrogen bonding.

To determine which of the given statements is NOT true, let's examine each option:

(A) CH2O Has a relatively high boiling point due to hydrogen bonding.
To determine if this statement is true or false, we need to consider the intermolecular forces present in CH2O, which is the chemical formula for formaldehyde. In CH2O, the only intermolecular force is dipole-dipole interactions, as hydrogen bonding requires a hydrogen atom bonded to an electronegative atom like nitrogen, oxygen, or fluorine. Therefore, statement (A) is NOT true because CH2O does not have a relatively high boiling point due to hydrogen bonding.

(b) BaCl2 is an example of an ionic solid.
To determine if this statement is true or false, we need to consider the bonding present in BaCl2. BaCl2 is composed of a metal (Ba) and a nonmetal (Cl), which indicates that it is likely an ionic compound. Therefore, statement (b) is true.

(c) Ionic solids are poor conductors of heat and electricity.
To evaluate this statement, we need to understand the properties of ionic compounds. Ionic solids are composed of positively and negatively charged ions held together by strong electrostatic forces. In the solid state, these ions are not free to move, making ionic solids poor conductors of both heat and electricity. Therefore, statement (c) is true.

(d) The melting point of Fe is higher than glucose.
To determine if this statement is true or false, we compare the melting points of iron (Fe) and glucose. Iron has a melting point of 1538 degrees Celsius, while glucose has a melting point of around 146-150 degrees Celsius. Therefore, statement (d) is true because the melting point of Fe is indeed higher than that of glucose.

(e) The melting point of diamond is higher than Cu.
To assess statement (e), we compare the melting points of diamond and copper (Cu). Diamond is a covalent network solid, and its strong covalent bonds make it have an extremely high melting point of around 3800 degrees Celsius. On the other hand, copper is a metallic solid with metallic bonding, which typically has a lower melting point. Therefore, statement (e) is also true because the melting point of diamond is higher than that of copper.

In summary, the statement that is NOT true is (A) CH2O has a relatively high boiling point due to hydrogen bonding.