How is the SIMM an improvement on the SIPPs and DIPs that preceded it? a. SIMMs are larger and thus hold more memory. b. Every SIMM houses a row of pins on each side. c. The SIMM is soldered to the system board.
To determine how the SIMM (Single Inline Memory Module) is an improvement on the SIPPs (Single Inline Pin Packages) and DIPs (Dual Inline Packages) that came before it, we can examine the given options:
a. SIMMs are larger and thus hold more memory: To verify this statement, we can compare the capacities of SIMMs, SIPPs, and DIPs. SIMMs are indeed larger modules that can accommodate more memory chips, allowing them to store more data than their predecessors. In contrast, SIPPs and DIPs had limited capacities due to their physical design, which restricted the amount of memory that could be installed.
b. Every SIMM houses a row of pins on each side: This statement describes the pin layout of SIMMs. Unlike SIPPs and DIPs, which had pins on both sides of the module or package, SIMMs had a single row of pins on each side. This design change simplified the installation process and reduced the chances of misalignment that could lead to connection issues.
c. The SIMM is soldered to the system board: This statement suggests that SIMMs were soldered directly to the computer's motherboard. However, this is not accurate. SIMMs were typically connected to the motherboard through memory slots or sockets, offering the advantage of easy installation and potential upgradeability.
Therefore, based on the given options, the correct answer is b. Every SIMM houses a row of pins on each side. SIMMs improved on SIPPs and DIPs by simplifying the pin layout and allowing for easier installation. However, their larger size and greater memory capacity (option a) and soldering to the system board (option c) are not accurate descriptions of SIMMs.