Wednesday

November 26, 2014

November 26, 2014

Posted by **Dawna** on Tuesday, January 22, 2013 at 5:42pm.

The filling is prepared at 20 degrees Celsius, but when it is baked it expands and .236 L of it flows over the edge of the pie pan and ends up in the bottom of the oven. Compute the thermal expansion for the volume of the pie plate itself, and then use the overflow amount for the filling to get an estimate for the thermal expansion coefficient (alpha pumpkin) of pumpkin pie filling.

Note: volume of the pie plate can be found using v=(1/3)( a1+a2+(square root of a1xa2))(h)

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